* CoolSiC (TM) Schottky diode gen 5
* High speed IGBT H3
* Low switching losses Mechanical Features
* 3 kV AC 1min insulation
* Al2O3 substrate with low thermal resistance
* Compact design
* PressFIT contact technology
* Rugged mounting
F4-3L50R07W2H3F_B11 Datasheet (1.09 MB)
F4-3L50R07W2H3F_B11
1.09 MB
Igbt.
F4-3L50R07W2H3F_B11 EasyPACK Modul mit schnellem Trench/Feldstopp High-Speed 3 IGBT und SiC Diode und PressFIT / NTC EasyPACK module with fast Trench/.
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