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FF11MR12W1M1P_B11 - MOSFET

Key Features

  • High current density.
  • Low inductive design.
  • Low switching losses Mechanical Features.
  • Integrated NTC temperature sensor.
  • PressFIT contact technology.
  • Rugged mounting due to integrated mounting clamps.
  • Pre-applied Thermal Interface Material Module Label Code Barcode Code 128 DMX - Code Content of the Code Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Datecode (Production Week) Digit.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FF11MR12W1M1P_B11 EasyDUALModulmitCoolSiC™TrenchMOSFETundPressFIT/NTC/TIM EasyDUALmodulewithCoolSiC™TrenchMOSFETandPressFIT/NTC/TIM VorläufigeDaten/PreliminaryData - PotentielleAnwendungen • AnwendungenmithohenSchaltfrequenzen • DC/DCWandler • SolarAnwendungen • USV-Systeme ElektrischeEigenschaften • HoheStromdichte • NiederinduktivesDesign • NiedrigeSchaltverluste MechanischeEigenschaften • IntegrierterNTCTemperaturSensor • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern • Thermisches Interface Material bereits aufgetragen VDSS = 1200V ID nom = 100A / IDRM = 200A PotentialApplications • HighFrequencySwitchingapplication • DC/DCconverter • Solarapplications • UPSsystems ElectricalFeatures • Highcurrent