The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest pow.
Advanced HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HE.
Image gallery
TAGS
Manufacturer
Related datasheet
Download (Size : 613.33KB)