erature ( °C) IAS Fig 12b. Unclamped Inductive Waveforms VGS QGS VG QG QGD Charge Fig 13a. Basic Gate Charge Waveform Fig 12c. Maximum Avalanche Energy Vs. Drain C.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest powe.

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET .

IRF540N

IRF540NLPbF

IRF540NPbF

IRF540NPBF

IRF540NS

IRF540NSPbF

IRF540

IRF540A

IRF540FI

IRF540PBF

IRF540S

IRF540Z

IRF540ZL