mperature 100 (Z thJA) D = 0.50 10 0.20 0.10 0.05 Thermal Response 1 0.02 0.01 P DM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = 2. Peak T t1/ t .

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6607 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is.

IRF6601

IRF6603

IRF6604

IRF6607TR1

IRF6608

IRF6609

IRF6609PBF

IRF6609TRPBF

IRF6610

IRF6611

IRF6611PbF

IRF6611TRPbF

IRF6612