, Temperature ( °C ) Fig 9. Maximum Drain Current vs. Case Temperature Fig 10. Threshold Voltage vs. Temperature 100 10 Thermal Response ( Z thJA ) 1 D = 0.50 0.2.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6609PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package.

IRF6609

IRF6609PBF

IRF6601

IRF6603

IRF6604

IRF6607

IRF6607TR1

IRF6608

IRF6610

IRF6611

IRF6611PbF

IRF6611TRPbF

IRF6612

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