IRF6617PBF - Power MOSFET
The IRF6617PbF combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a Micro8™ and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used
PD -97082 IRF6617PbF IRF6617TRPbF l l l l l l l l l RoHS Compliant Lead-Free (Qualified up to 260°C Reflow) Application Specific MOSFETs Ideal for CPU Core DC-DC Converters Low Conduction Losses High Cdv/dt Immunity Low Profile (<0.7mm) Dual Sided Cooling Compatible Compatible with existing Surface Mount Techniques DirectFET Power MOSFET * VDSS 30V RDS(on) max 8.1mΩ@VGS = 10V 10.3mΩ@VGS = 4.5V Qg(typ.) 11nC Applicable DirectFET Outline and Substrate Outline (see p.7, 8 for deta
IRF6617PBF Features
* ig 14b. Unclamped Inductive Waveforms
+
VDD D.U.T VGS Pulse Width < 1µs Duty Factor < 0.1%
90%
VDS
10%
VGS
td(on) tr td(off) tf
Fig 15a. Switching Time Test Circuit
Current Regulator Same Type as D.U.T.
Fig 15b. Switching Time Waveforms
Id Vds Vgs
50KΩ 12V .2µF .3µF
D.U.T. VGS
3mA
+ V - DS