Description
The IRF6641PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile.
Features
- = 150°C Single Pulse 1 10 100
1msec
1000
Fig 10. Typical Source-Drain Diode Forward Voltage
Typical VGS(th) , Gate threshold Voltage (V)
Fig11. Maximum Safe Operating Area
6.0
VDS, Drain-to-Source Voltage (V)
5
4
ID, Drain Current (A)
5.0
3
4.0 ID ID ID ID = 150µA = 250µA = 1.0mA = 1.0A
2
3.0
1
0 25 50 75 100 125 150 TA , Ambient Temperature (°C)
2.0 -75 -50 -25 0 25 50 75 100 125 150 T J , Temperature ( °C )
Fig 12. Maximum Drain Current vs. Ambient Temperature
200
EAS , Single.