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MD4832-D512-V3Q18-X Datasheet Flash Memory

Manufacturer: M-Systems

Download the MD4832-D512-V3Q18-X datasheet PDF. This datasheet also includes the MD4832-D512-V3Q18-X-P_M variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (MD4832-D512-V3Q18-X-P_M-Systems.pdf) that lists specifications for multiple related part numbers.

Overview

www.DataSheet4U.com Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, September 2003 Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems.

MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell.

x2 technology enables MLC NAND to achieve highly reliable, high-performance data and code storage with a specially designed error detection and correction mechanism, optimized file management, and proprietary algorithms for enhanced performance.

Key Features

  • High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.

More Datasheets from M-Systems

Part Number Description
MD4832-D512-V3Q18-X-P Flash Memory
MD4832-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
MD4811-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
MD4331-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk