Description
6 512Mb Standard Interface 7
2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Ball Diagram 14 System Interface 15 Signal Description 16 Pin/Ball Diagram 18 System Interface 20 Signal Description 21 Ball Diagram 25 System Interface 26 Signal Description 27
2
Features
- High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB)
Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.
MD4832-Dxx Datasheet
