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MD4832-Dxx - Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk

Download the MD4832-Dxx datasheet PDF. This datasheet also covers the MD4331-Dxx_M variant, as both devices belong to the same mobile diskonchip g3 512mbit/1gbit flash disk family and are provided as variant models within a single manufacturer datasheet.

General Description

6 512Mb Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Ball Diagram 14 System Interface 15 Signal Description 16 Pin/Ball Diagram 18 System Interface 20 Signal Description 21 Ball Diagram 25 System Interface 26 Signal Description 27 2

Key Features

  • High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MD4331-Dxx_M-Systems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MD4832-Dxx
Manufacturer M-Systems
File Size 879.86 KB
Description Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
Datasheet download datasheet MD4832-Dxx Datasheet

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Other Datasheets by M-Systems

Part Number Description
MD4832-D512-V3Q18-X Flash Memory
MD4832-D512-V3Q18-X-P Flash Memory
MD4811-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
MD4331-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 www.DataSheet4U.com Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems®. MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell. x2 technology enables MLC NAND to achieve highly reliable, high-performance data and code storage with a specially designed error detection and correction mechanism, optimized file management, and proprietary algorithms for enhanced performance.