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MD4832-D512-V3Q18-X-P - Flash Memory

Download the MD4832-D512-V3Q18-X-P datasheet PDF. This datasheet also covers the MD4832-D512-V3Q18-X-P_M variant, as both devices belong to the same flash memory family and are provided as variant models within a single manufacturer datasheet.

General Description

Updated RSRVD signal description Reference Section 2.2.3 Section 2.3.3 Section 2.4.3 DiskOnChip Control Register/Control Confirmation Register mapping corrected Icc Active supply current updated Mechanical dimensions for 7x10 FBGA package updated 69-ball FBGA 9x12 daisy-chain ordering info

Key Features

  • High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MD4832-D512-V3Q18-X-P_M-Systems.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by M-Systems

Part Number Description
MD4832-D512-V3Q18-X Flash Memory
MD4832-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
MD4811-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk
MD4331-Dxx Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, September 2003 Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems. MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell. x2 technology enables MLC NAND to achieve highly reliable, high-performance data and code storage with a specially designed error detection and correction mechanism, optimized file management, and proprietary algorithms for enhanced performance.