Description
Updated RSRVD signal description Reference Section 2.2.3 Section 2.3.3 Section 2.4.3 DiskOnChip Control Register/Control Confirmation Register mapping corrected Icc
Active supply current updated Mechanical dimensions for 7x10 FBGA package updated 69-ball FBGA 9x12 daisy-chain ordering info
Features
- High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB)
Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support MultiBurst operation Turbo operation Unriva.
MD4832-D512-V3Q18-X Datasheet
