MD4811-Dxx Datasheet | M-Systems

features High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling e Xecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm package Enhanced performance by implementation of: Multi-plane operation DMA support Multi Burst operation Turbo operation Unrivaled data integrity with a robust Error Detection Code/Error Correction Code (EDC/ECC) tailored for MLC NAND flash technology Maximized flash endurance with True FFS® 6.1 (and higher) Support for major mobile operating systems (OSs), including Symbian OS, Pocket PC 2002/3, Smartphone 2002/3, Palm OS, Nucleus, Linux, Windows CE, and more. patible with major mobile CPUs, including TI OMAP, XScale, Motorola Dragon Ball MX1 and Qualm MSMxxxx. 91-SR-011-05-8L Preliminary Data Sheet, Rev. 1.0 Mobile Disk On Chip G3 Performance Boot Capability Multi Burst read: 80 MB/sec Erase: 30 MB/sec Sustained read: 5 MB/sec Sustained write: 1.1 MB/sec Access time: Normal: 55 nsec Turbo: 33 nsec .. Multi Burst: 25 nsec Protection & Security-Enabling Features 16-byte Unique Identification (UID) number 6KByte user-controlled One Time Programmable (OTP) area Two configurable hardware-protected partitions for data and code: Read-only mode Write-only mode One-Time Write mode (ROM-like) partition Protection key and LOCK# signal Sticky Lock (SLOCK) to lock boot partition Protected Bad Block Table Reliability and Data Integrity Programmable Boot Block with XIP capability to replace boot NOR 2KB for 512Mb devices 4KB for 1Gb devices Download Engine (DE) for automatic download of boot code from Programmable Boot Block Boot options: CPU initialization...