MT28F322P3 memory equivalent, flash memory.
* Flexible dual-bank architecture Support for true concurrent operation with zero latency Read bank a during program bank b and vice versa Read bank a during erase ba.
Table. See page 35 for mechanical drawing.
OPTIONS
* Timing 70ns access 80ns access
* Boot Block Configuration Top Bottom
* Package 48-ball FBGA (6 x 8 ball grid)
* Operating Temperature Range Commercial (0ºC to +70ºC) Extended (-40º.
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