Datasheet Details
| Part number | MSAFA1N100D |
|---|---|
| Manufacturer | Microsemi (now Microchip Technology) |
| File Size | 78.60 KB |
| Description | Fast MOSFET Die |
| Datasheet |
 MSAFA1N100D Datasheet
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| Part number | MSAFA1N100D |
|---|---|
| Manufacturer | Microsemi (now Microchip Technology) |
| File Size | 78.60 KB |
| Description | Fast MOSFET Die |
| Datasheet |
MSAFA1N100D Datasheet
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: • • • N-Channel enhancement mode high density MOSFET die Passivation: oxynitride, 4um Frontside (top) Metallization: Al/1%Cu for aluminum wire bonding, 9 um typical.
Backside Metallization: Ti – Ni (1 um) – Ag (0.2 um) for soft solder attach Low On-state resistance Avalanche and Surge Rated High Freq.
Switching Ultra Low Leakage Current UIS rated Available with Lot Acceptance Testing Spec MSAFA1N100DL, "-L" Suffix
2830 S.
Fairview Street Santa Ana, CA 92704 Phone: (714) 979-8220 Fax: (714) 559-5989 www.DataSheet4U.
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