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MMBT2222ALT1 - General Purpose Transistors

Datasheet Summary

Features

  • m preheating to soldering, the maximum temperature gradient shall be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling.
  • Soldering a device without preheating can cause excessive ther.

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Datasheet Details

Part number MMBT2222ALT1
Manufacturer Motorola
File Size 253.60 KB
Description General Purpose Transistors
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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT2222LT1/D General Purpose Transistors NPN Silicon 1 BASE COLLECTOR 3 MMBT2222LT1 MMBT2222ALT1* *Motorola Preferred Device MAXIMUM RATINGS Rating Collector – Emitter Voltage Collector – Base Voltage Emitter – Base Voltage Collector Current — Continuous Symbol VCEO VCBO VEBO IC 2222 30 60 5.0 600 2222A 40 75 6.0 2 EMITTER 1 3 Unit Vdc Vdc Vdc mAdc 2 CASE 318 – 08, STYLE 6 SOT– 23 (TO – 236AB) THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR– 5 Board(1) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate,(2) TA = 25°C Derate above 25°C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Symbol PD Max 225 1.
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