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Motorola Electronic Components Datasheet

MSA1022-CT1 Datasheet

PNP RF Amplifier Transistor Surface Mount

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MOTOROLA
www.DSatEaSMhIeCetO4UN.cDoUmCTOR TECHNICAL DATA
Order this document
by MSA1022–CT1/D
PNP RF Amplifier Transistor
Surface Mount
COLLECTOR
3
MSA1022-CT1
Motorola Preferred Device
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Collector–Base Voltage
VCBO
Collector–Emitter Voltage
VCEO
Emitter–Base Voltage
VEBO
Collector Current — Continuous
IC
THERMAL CHARACTERISTICS
Characteristic
Symbol
Power Dissipation
PD
Junction Temperature
TJ
Storage Temperature
Tstg
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Collector Cutoff Current
(VCB = –10 Vdc, IE = 0)
Collector–Emitter Breakdown Voltage
(VCE = – 20 Vdc, IB = 0)
Emitter–Base Breakdown Voltage
(VEB = – 5.0 Vdc, IC = 0)
DC Current Gain(1)
(VCE = –10 Vdc, IC = –1.0 mAdc)
Current–Gain — Bandwidth Product
(VCB = –10 Vdc, IE = 1.0 mAdc)
1. Pulse Test: Pulse Width 300 µs, D.C. 2%.
DEVICE MARKING
2
BASE
1
EMITTER
Value
– 30
– 20
– 5.0
– 30
Unit
Vdc
Vdc
Vdc
mAdc
Max
200
150
– 55 ~ +150
Unit
mW
°C
°C
Symbol
ICBO
ICEO
IEBO
hFE
fT
2
1
3
CASE 318D–03, STYLE 1
SC–59
Min Max Unit
– 0.1
µAdc
–100
µAdc
— –10 µAdc
110 220 —
150 — MHz
Marking Symbol
ECX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
(Replaces MSA1022–BT1/D)
Motorola Small–Signal Transistors, FETs and Diodes Device Data
© Motorola, Inc. 1996
1


Motorola Electronic Components Datasheet

MSA1022-CT1 Datasheet

PNP RF Amplifier Transistor Surface Mount

No Preview Available !

MSA1022-CT1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.039
1.0
0.031
0.8
0.098–0.118
2.5–3.0
0.094
2.4
inches
mm
SC–59 POWER DISSIPATION
The power dissipation of the SC–59 is a function of the pad
size. This can vary from the minimum pad size for soldering
to the pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
RθJA, the thermal resistance from the device junction to
ambient; and the operating temperature, TA. Using the
values provided on the data sheet, PD can be calculated as
follows:
TJ(max) – TA
PD =
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 200 milliwatts.
150°C – 25°C
PD = 625°C/W = 200 milliwatts
The 625°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad. Using a board material such as
Thermal Clad, a power dissipation of 400 milliwatts can be
achieved using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
The soldering temperature and time should not exceed
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
2 Motorola Small–Signal Transistors, FETs and Diodes Device Data


Part Number MSA1022-CT1
Description PNP RF Amplifier Transistor Surface Mount
Maker Motorola
Total Page 4 Pages
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