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MSC8101 - Network Digital Signal Processor

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3-1 Lidded FC-PBGA Package Mechanical Drawing 3-31 Thermal Design Considerations 4-1 Electrical Design Considerations 4-1 Power Considerations 4-2 Layout Practices 4-3 Chapter 2 Physical and Electrical Specifications 2.1 2.2 2.3 2.4 2.5 2.6 Chapter 3 Packaging 3.1 3.2 Chapter 4 Design Consid

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Freescale Semiconductor Technical Data MSC8101 Rev.
Published: |