BYG50D Key Features
- Glass passivated
- High maximum operating temperature
- Low leakage current
- Excellent stability
- Guaranteed avalanche energy absorption capability
- UL 94V-O classified plastic package
- Shipped in 12 mm embossed tape
- Part: BYG50D
- Manufacturer: NXP Semiconductors (official site)
- Size: 41.11 KB
Related NXP Semiconductors Datasheets
| Part Number | Description |
|---|---|
| BYG50 | Controlled avalanche rectifiers |
| BYG50G | Controlled avalanche rectifiers |
| BYG50J | Controlled avalanche rectifiers |
| BYG50K | Controlled avalanche rectifiers |
| BYG50M | Controlled avalanche rectifiers |
BYG50D Description
SOD106 surface mountable package with glass passivated chip. cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC; LIMITING VALUES In accordance with the Rating System (IEC 134).