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BYG50D - Controlled avalanche rectifiers

NXP

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Datasheet Details

Part number	BYG50D
Manufacturer	NXP ↗
File Size	41.11 KB
Description	Controlled avalanche rectifiers
Datasheet	BYG50D_PhilipsSemiconductors.pdf

BYG50D Product details

Description

DO-214AC; SOD106 surface mountable package with glass passivated chip.

Features

Glass passivated.
High maximum operating temperature.
Low leakage current.
Excellent stability.
Guaranteed avalanche energy absorption capability.
UL 94V-O classified plastic package.
Shipped in 12 mm embossed tape. Top view Side view handbook, 4 columns BYG50 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

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Published: Mar 23, 2005 |