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BYG50D Datasheet Controlled Avalanche Rectifiers

Manufacturer: NXP Semiconductors

Overview: DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary specification 1996 May 24 Philips Semiconductors Preliminary specification Controlled avalanche.

General Description

DO-214AC;

SOD106 surface mountable package with glass passivated chip.

cathode band k a MSA474 Fig.1 Simplified outline (DO-214AC;

Key Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Guaranteed avalanche energy absorption capability.
  • UL 94V-O classified plastic package.
  • Shipped in 12 mm embossed tape. Top view Side view handbook, 4 columns BYG50 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

More Datasheets from NXP Semiconductors

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BYG26D SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26G SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG26J SMA ultra fast soft-recovery controlled avalanche rectifiers
BYG60 Fast soft-recovery controlled avalanche rectifiers

BYG50D Distributor