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OSD3358-SM - Processor

Description

16 5.2 Not Connected Balls 19 5.3 Reserved Signals 20 6 OSD335x-SM Components 21 6.1 AM335x Processor 21 6.1.1 I/O Voltages 21 6.2 DDR3 Memory 21 6.3 EEPROM 23 6.3.1 EEPROM Contents 23 6.3.2 EEPROM Write Protection 23 7 Power Management 24 7.1 Input Power 24 7.1.1 VIN_AC 24 7.1.2 VIN_USB 24

Features

  • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components integrated into a single package.
  • TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 o LCD Controller o SGX 3D Graphics Engine o PRU Subsystem.
  • Access to all AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc.
  • Up to 1GB DDR3 OSD335x-SM Family Rev. 11 8/22/2022 OSD335x-SM Block Diagram.

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Datasheet Details

Part number OSD3358-SM
Manufacturer OCTAVO
File Size 1.04 MB
Description Processor
Datasheet download datasheet OSD3358-SM Datasheet
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Full PDF Text Transcription

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Introduction The OSD335x-SM Family of System-InPackage (SiP) products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x-SM integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte (GB) of DDR3 Memory, a 4 Kilobyte (KB) EEPROM for non-volatile configuration storage and resistors, capacitors, and inductors into a single 21mm x 21mm design-in-ready package. With this level of integration, the OSD335xSM Family of SiPs allows designers to focus on the key aspects of their system without spending time on the complicated highspeed design of the processor/DDR3 interface or the PMIC power distribution.
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