* DIP Silicon Carbide Full Bridge Power Module for On−Board
Charger (OBC) for xEV Applications
* Creepage and Clearance per IEC60664−1, IEC 60950−1
* Compact .
* Creepage and Clearance per IEC60664−1, IEC 60950−1
* Compact Design for Low Total Module Resistance
* Modu.
Pin No.
1, 2, 7, 8, 9, 10, 15, 16, 19, 20, 23, 24, 27, 28 3 4 5 6 11 12 13 14 17, 18 21, 22 25, 26 29 30 31, 32
Pin Name NC
Not Connected pin
G2 S2 G1 S1 S4 G4 S3 G3 B− PH1 PH2 NTC1 NTC2 B+
Q2 Gate Q2 Source Q1 Gate Q1 Source Q4 Source Q4 Gate Q3.
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