* DIP Silicon Carbide 3−Phase Bridge Power Module for On−board
Charger (OBC) for xEV Applications
* Creepage and Clearance per IEC 60664−1, IEC 60950−1
* Comp.
* Creepage and Clearance per IEC 60664−1, IEC 60950−1
* Compact Design for Low Total Module Resistance
* Mod.
Pin No.
1, 2, 15, 16, 19, 20, 27, 28 3 4 5 6 7 8 9 10 11 12 13 14
17, 18 21, 22 23, 24 25, 26
29 30 31, 32
Pin Name NC G2 S2 G1 S1 G4 S4 S3 G3 S6 G6 S5 G5 B− PH1 PH2 PH3
NTC1 NTC2
B+
Not Connected Q2 Gate Q2 Source Q1 Gate Q1 Source Q4 Gate Q4 Sour.
Image gallery
TAGS
Manufacturer
Related datasheet