KFG2G16Q2M - 2Gb OneNAND M-Die

Datasheet Summary

Description

Chapter 2.8.3 : Eliminated ’Top boot’ option.

Features

including: xA BootRAM and bootloader xTwo independent bi-directional 2KB DataRAM buffers xA High-Speed x16 Host Interface xOn-chip Error Correction xOn-chip NOR interface controller This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in.

Samsung semiconductor

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Datasheet Details

Part number	KFG2G16Q2M
Manufacturer	Samsung semiconductor
File Size	2.59 MB
Description	2Gb OneNAND M-Die
Datasheet	KFG2G16Q2M Datasheet
Additional preview pages of the KFG2G16Q2M datasheet.

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Full PDF Text Transcription

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OneNAND2G(KFG2G16Q2M-DEBx) OneNAND4G(KFH4G16Q2M-DEBx) OneNAND8G(KFW8G16Q2M-DEBx) FLASH MEMORY www.DataSheet4U.com KFG2G16Q2M KFH4G16Q2M KFW8G16Q2M 2Gb OneNAND M-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2.

Published: Oct 22, 2008 |