* Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 18 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BV
SQ2904A
Semicoa Semiconductor
29.39 KB
Chip type 2c2904a geometry 0600 polarity pnp.
Data Sheet No. 2C2904A Chip Type 2C2904A Geometry 0600 Polarity PNP Generic Packaged Parts: 2N2904A Chip type 2C2904A by Semicoa Semiconductors pro.
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