SB073P200-W-AG Overview
Key Features
- Solderable Surface Ti/Ni/Ag
- Wire Bond Surface Aluminium
- Suffix "Al" Anode Solderable Surface Ti/Ni/Ag Cathode Cathode Symbol
| Part | SB073P200-W-AG |
|---|---|
| Description | Schottky Barrier Diode Wafer |
| Category | Diode |
| Manufacturer | TRANSYS Electronics Limited |
| Size | 184.23 KB |
Related Datasheets
| Part Number | Manufacturer | Description |
|---|---|---|
| SB073P150-W-AG | TRANSYS Electronics Limited | Schottky Barrier Diode Wafer |
| SB073P150-W-AL | TRANSYS Electronics Limited | Schottky Barrier Diode Wafer |
| HF70D120ACE | International | Haxfred Die in Wafer Form |