• Part: TC358774XBG
  • Description: Mobile Peripheral
  • Manufacturer: Toshiba
  • Size: 391.76 KB
Download TC358774XBG Datasheet PDF
Toshiba
TC358774XBG
Overview The TC358774XBG/TC358775XBG Functional Specification defines operation of the DSISM to LVDS low power chip (or more abbreviated, TC358775XBG chip). TC358775XBG is the follow-up chip of TC358764XBG/ TC358765XBG, which: 1. Is pin patible to TC358764XBG/TC358765XBG P-VFBGA49-0505-0.65-001 Weight: 39 mg (Typ.) 2. Exhibit LVDS Tx block operates at 1.8V @135 MHz to reduce operation power TC358775XBG 3. Update 4-lane DSI Rx max bit rate @ 1 Gbps/lane to support 1920×1200×24 @60fps 4. Add STBY pin with to enable turning on VDDIO power first before other power supplies. The primary function of this chip is DSI-to-LVDS Bridge, enabling P-VFBGA64-0606-0.65-001 Weight: 55 mg (Typ.) video streaming output over DSI link to drive LVDS-patible display panels. The chip supports up to 1600×1200 24-bits per pixel resolution for single-link LVDS and up to WUXGA (1920×1200 24-bits pixels) resolution for dual-link LVDS. As a secondary function, the chip also supports...