SE30PAD Key Features
- Very low profile
- typical height of 0.95 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage
- ESD capability
- Meets MSL level 1, per J-STD-020, LF maximum
- Not remended for PCB bottom side wave mounting
- AEC-Q101 qualified
- Material categorization: for definitions of pliance
