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FCSP130TR - Chip Scale Package Schottky Barrier Rectifier

General Description

True chip-scale packaging is available from Vishay HPP.

The FCSP130TR surface mount Schottky rectifier has been designed for applications requiring low forward drop and very small footprints on PC boards.

Key Features

  • Ultra low VF per footprint area.
  • Low thermal resistance.
  • One-fifth footprint of SMA.
  • Super low profile (< 0.7 mm).
  • Available tested on tape and reel.
  • Small footprint, surface mountable FlipKY® RoHS.

📥 Download Datasheet

Datasheet Details

Part number FCSP130TR
Manufacturer Vishay
File Size 114.39 KB
Description Chip Scale Package Schottky Barrier Rectifier
Datasheet download datasheet FCSP130TR Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FCSP130TR Vishay High Power Products FlipKY®, 1.0 A FEATURES • Ultra low VF per footprint area • Low thermal resistance • One-fifth footprint of SMA • Super low profile (< 0.7 mm) • Available tested on tape and reel • Small footprint, surface mountable FlipKY® RoHS COMPLIANT • Low forward voltage drop • High frequency operation • Guard ring for enhanced ruggedness and long term reliability • Lead (Pb)-free • Designed for consumer level DESCRIPTION True chip-scale packaging is available from Vishay HPP. The FCSP130TR surface mount Schottky rectifier has been designed for applications requiring low forward drop and very small footprints on PC boards.