Datasheet Details
| Part number | WCMC2016V1X |
|---|---|
| Manufacturer | Weida Semiconductor |
| File Size | 167.62 KB |
| Description | 128K x 16 Pseudo Static RAM DIE |
| Datasheet | WCMC2016V1X_WeidaSemiconductor.pdf |
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Overview: ADVANCE INFORMATION General Physical Specification WCMC2016V1X 128K x 16 Pseudo Static RAM DIE Substrate Connection Req.: Ground Wafer Diameter [mm]: 200.00 Die Size [µm]: 4010.74 x 1565.84 Step Size [µm]: 4095.44 x 1650.89 Scribe Size [µm]: 84.70 x 84.94 Pad Count: 64 Pad Size [µm]: 73.6 x 73.6 For product parameters and availability, please refer to the WCMC2016V1X product datasheet available on the Cypress Semiconductor Website (http://.cypress.). Mfg Part Number: GC2016V5A Die Part Number: Die Technology: PowerChip 0.
| Part number | WCMC2016V1X |
|---|---|
| Manufacturer | Weida Semiconductor |
| File Size | 167.62 KB |
| Description | 128K x 16 Pseudo Static RAM DIE |
| Datasheet | WCMC2016V1X_WeidaSemiconductor.pdf |
|
|
|
Die (25-30 mil) in wafer form.
Die (14 mil) in wafer form.
Die (11 mil) in wafer form.
| Part Number | Description |
|---|---|
| WCMC1616V9X | 1Mb x 16 Pseudo Static RAM |
| WCMC8016V9X | 8Mb (512K x 16) Pseudo Static RAM |
| WCMA1008C1X | 128K x 8 Static RAM |
| WCMA1008U1X | 128K x 8 Static RAM |
| WCMA1016U4X | 64K x 16 Static RAM |
| WCMA2008U1B | 256K x 8 Static RAM |
| WCMA2008U1X | 256K x 8 Static RAM |
| WCMA2016U4B | 128K x 16 Static RAM |
| WCMA2016U4X | 128K x 16 STATIC |
| WCMA4008C1X | 512K x 8 Static RAM |