WT-Z210V-AU4 - Zener Diode Chips(Dual Pad)

Weitron Technology

Datasheet Details

Part number	WT-Z210V-AU4
Manufacturer	Weitron Technology
File Size	176.89 KB
Description	Zener Diode Chips(Dual Pad)
Datasheet	WT-Z210V-AU4 Datasheet

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WT-Z210V-AU4 Zener Diode Chips (Dual Pad) for ESD Bidrectional Protection 1. Feature: 1-1 Silicon Zener diode chips for electrostatic discharge (ESD) protection application 1-2 This specification applies to N/P/N-Type silicon Zener diode chip (Dual pad/Vertical) Device NO:WT-Z210V-AU4 2. Structure: 2-1 Planar type: Silicon Diode 2-2 Electrodes: Top side : Gold Pad.(Cathode) Back side : Gold Layer.(Anode) 3. Size: 3-1 Chip size: 10.0 mils x 10.0 mils (254 um x 254 um). 3-2 Chip thickness: 4.0 ± 1.0 mils (100 ± 25.4 um). 3-3 Dual Bonding pad: 7.7 mils x 7.7mils (195um x 195um). 3-4 Pattern drawing: Refer to the attached drawing. 4.