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WSF41632-22XX - 128K x 32 SRAM & 512K x 32 FLASH MIXED MODULE

Description

D0-31 A0-18 SWE#1-4 SCS# OE# VCC GND NC FWE#1-4 FCS Data Inputs/Outputs Address Inputs SRAM Write Enables SRAM Chip Select Output Enable Power Supply Ground Not Connected Flash Write Enables Flash Chip Select 56 Block Diagram FWE 1 # SWE 1 # FWE 2 # SWE 2 # FWE 3 # SWE 3 # FWE 4 # SWE 4 # 128K x

Features

  • Access times of 25ns (SRAM) and 120ns (FLASH) Packaging.
  • 66 pin, PGA Type, 1.385" square HIP, hermetic ceramic HIP (Package 402).
  • 68 lead, hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 2). Package to be developed. 128Kx32 SRAM 512Kx32 5V Flash Organized as 128Kx32 of SRAM and 512Kx32 of Flash Memory with common data bus Low power CMOS Commercial, industrial and military temperature ran.

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Datasheet Details

Part number WSF41632-22XX
Manufacturer White Electronic
File Size 552.72 KB
Description 128K x 32 SRAM & 512K x 32 FLASH MIXED MODULE
Datasheet download datasheet WSF41632-22XX Datasheet

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www.DataSheet4U.com White Electronic Designs WSF41632-22XX PRELIMINARY* 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE FEATURES Access times of 25ns (SRAM) and 120ns (FLASH) Packaging • 66 pin, PGA Type, 1.385" square HIP, hermetic ceramic HIP (Package 402) • 68 lead, hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 2). Package to be developed. 128Kx32 SRAM 512Kx32 5V Flash Organized as 128Kx32 of SRAM and 512Kx32 of Flash Memory with common data bus Low power CMOS Commercial, industrial and military temperature ranges TTL compatible inputs and outputs * This product is under development, is not qualified or characterized and is subject to change without notice.
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