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WED3C7558M-XBX - RISC Microprocessor

Key Features

  • doze, nap, sleep and dynamic power management. The WED3C7558M-XBX multichip package consists of: 755 RISC processor Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Maximum 60x Bus frequency = 66MHz The WED3C7558M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded.

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Datasheet Details

Part number WED3C7558M-XBX
Manufacturer White Electronic Designs
File Size 571.02 KB
Description RISC Microprocessor
Datasheet download datasheet WED3C7558M-XBX Datasheet

Full PDF Text Transcription (Reference)

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www.datasheet4u.com White Electronic Designs WED3C7558M-XBX RISC Microprocessor Multichip Package OVERVIEW The WEDC 755/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.