TX7332
Description
The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF).
Key Features
- 1 TX7332 supports: - 32-channel three-level pulser and active transmit/receive (T/R) switch - Very low power on-chip beamforming mode: - In receive-only mode: 0.45 mW/ch - In transmit-receive mode: 16.4 mW/ch - In CW mode: 160 mW/ch - In global power-down mode: 0.1 mW/ch
- Three-level pulser: - Maximum output voltage: ±100 V - Minimum output voltage: ±1 V - Maximum output current: 1.2 A to 0.3 A - Maximum clamp current: 0.5 A to 0.12 A - Second harmonic : -45 dBc at 5 MHz - CW mode jitter: 100 fs measured from 100 Hz to 20 kHz - CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal - -3-dB bandwidth with 2-kΩ || 120-pF load - 20 MHz (for ±100-V supply) - 25 MHz (for ±70-V supply)
- Active T/R switch with: - ON, OFF control signals - Bandwidth: 50 MHz - HD2: -50 dBc - Turnon resistance: 24 Ω - Turnon time: 0.5 µs - Turnoff time: 1.75 µs - Transient glitch: 50 mVPP
- Off-chip beamformer with: - Jitter cleaning using synchronization feature - Maximum synchronization clock frequency: 200 MHz
- On-chip beamformer with: - Delay resolution: one beamformer clock period - Maximum delay: 213 beamformer clock period - Maximum beamformer clock speed: 200 MHz - On-chip RAM to store - 16 delay profiles - 32 pattern profiles
- High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
- Automatic thermal shutdown
- No specific power sequencing requirement
- Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch
