* 8-C PROD. NAME ABC'S DWG NO. SW1608
* L
* -
* PAGE: 8 WOUND CHIP INDUCTOR ABC'S ITEM NO. Component adhesion (Push test) 20N：2012，2520，3225 10N：1608 5N：1005 The device shall be reflow soldered (230±5℃ for 10 seconds) to a tinned cop
SW1608xxxxLx-xxx Datasheet (209.42 KB)
SW1608xxxxLx-xxx
ABC Taiwan Electronics
209.42 KB
Wound chip inductor.
SPECIFICATION FOR APPROVAL REF : 20090828-C PROD. NAME ABC'S DWG NO. SW1608 L - .
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