CP753V Datasheet - Central Semiconductor

CP753V PNP Transistor

PROCESS Small Signal Transistors CP753V PNP - High Current Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter 1 Bonding Pad Area Emitter 2 Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 66 x 66 MILS 7.1 MILS 7.9 x 7.9 MILS 7.9 x 9.5 MILS 7.9 x 9.5 MILS Al-Si - 30,000Å Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 3,878 PRINCIPAL DEVICE TYPES CZT953 R2 (22-March 2010) w w w..

CP753V_CentralSemiconductor.pdf