CPD48V Datasheet (Central Semiconductor) - Schottky Diode High Current Schottky Diode

CPD48V, Schottky Diode High Current Schottky Diode

PROCESS CPD48V Schottky Diode High Current Schottky Diode Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 13.8 x 13.8 MILS 7.1 MILS 9.0 x 9.0 MILS Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 89,720 PRINCIPAL DEVICE TYPES CMPSH-3 Series CMSSH-3 Series CMXSH-3 CMKSH-3T BACKSIDE CATHODE R3 (22-March 2010) w w w.

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c o m PROCESS CPD48V Typical