CPD107 Datasheet - centralsemi

CPD107 3 Amp Schottky Rectifier

PROCESS Schottky Rectifier CPD107 3 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 56 x 56 MILS 11.8 MILS 51 x 51 MILS Al - 30,000Å Ag - 20,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 5,516 PRINCIPAL DEVICE TYPE CZSH6-100C R0 (1-March 2011) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD107 Typical Electrical Characteristics R0 (1-March 2011) w w w. c e n t r a l s e m i . .

CPD107-centralsemi.pdf