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PROCESS
Ultra Fast Rectifier
CPD16
1 Amp Glass Passivated Rectifier Chip
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PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 51 x 51 MILS 14 MILS 34 x 34 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å
GEOMETRY GROSS DIE PER 4 INCH WAFER 4,250 PRINCIPAL DEVICE TYPES UES1001 thru UES1003 UF4001 thru UF4007 CMR1U-01 Series CMR1U-01M Series
BACKSIDE CATHODE
R4 (22-March 2010)
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PROCESS
CPD16
Typical Electrical Characteristics
R4 (22-March 2010)
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CPD16 Datasheet
