CPD66X Datasheet (Central Semiconductor) - Low Leakage Diode Low Leakage Diode

CPD66X, Low Leakage Diode Low Leakage Diode

PROCESS CPD66X Low Leakage Diode Low Leakage Diode Chip www.DataSheet4U.com PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 17.5 x 17.5 MILS 5.9 MILS 7.9 MILS DIAMETER Al - 30,000Å Au-As - 13,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 54,848 PRINCIPAL DEVICE TYPES CMOD3003 CMLD3003DOG CMPD3003A CMPD3003C CMPD3003S R1 (19-July 2010) w w w.

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c o m PROCESS CPD66X Typical Electrical Characteristics R1 (19-July