DS21FF42 Datasheet - Dallas Semiconducotr

DS21FF42 4 X 3 Twelve Channel T1 Framer

The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. All of th.

DS21FF42 Features

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* Sixteen (16) or Twelve (12) Completely Independent T1 Framers in One Small 27mm x 27mm Package

* Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die. Each Quad Framer Can be Concatenated into a Single 8.192MHz Backplane Data Stream

DS21FF42_DallasSemiconducotr.pdf