DS21FF42 Datasheet (Dallas Semiconducotr) - 4 X 3 Twelve Channel T1 Framer

DS21FF42, 4 X 3 Twelve Channel T1 Framer

The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer.

Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1.

All of th

DS21FF42 Features

* P

* Sixteen (16) or Twelve (12) Completely Independent T1 Framers in One Small 27mm x 27mm Package

* Each Multi-Chip Module (MCM) Contains Four (FF) or Three (FT) DS21Q42 Die. Each Quad Framer Can be Concatenated into a Single 8.192MHz Backplane Data Stream