DS21FT40 Datasheet - Dallas Semiconducotr

DS21FT40 Four x Three 12 Channel E1 Framer

The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. The DS21FT40 is closely related to the DS21FT44. Most of the functions of .

DS21FT40 Features

* Twelve (12) completely independent E1 Framers in one small 27 mm x 27 mm Package

* Each Multi-Chip Module (MCM) Contains Three DS21Q44 Quad E1 Framer Die

* Each Quad Framer can be concatenated into a Single 8.192 MHz Backplane Data Stream

* 300

* pin MCM 1.27

DS21FT40_DallasSemiconducotr.pdf