Datasheet4U Logo Datasheet4U.com

DIM200PHM33-F000 Datasheet - Dynex Semiconductor

DIM200PHM33-F000 - Igbt Modules - Half Bridge

DIM200PHM33-F000 Features

* I I I I KEY PARAMETERS VCES VCE(sat)

* IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability

* Measured at auxiliary terminals. APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1

DIM200PHM33-F000_DynexSemiconductor.pdf

Preview of DIM200PHM33-F000 PDF
DIM200PHM33-F000 Datasheet Preview Page 2 DIM200PHM33-F000 Datasheet Preview Page 3

Datasheet Details

Part number:

DIM200PHM33-F000

Manufacturer:

Dynex Semiconductor

File Size:

208.38 KB

Description:

Igbt modules - half bridge.

DIM200PHM33-F000 Distributor

📁 Related Datasheet

📌 All Tags