Part number:
DIM200PHM33-F000
Manufacturer:
Dynex Semiconductor
File Size:
208.38 KB
Description:
Igbt modules - half bridge.
DIM200PHM33-F000 Datasheet (208.38 KB)
* I I I I KEY PARAMETERS VCES VCE(sat)
* IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability
* Measured at auxiliary terminals. APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1
DIM200PHM33-F000 Datasheet (208.38 KB)
DIM200PHM33-F000
Dynex Semiconductor
208.38 KB
Igbt modules - half bridge.
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