DIM200PHM33-F000

Igbt Modules - Half Bridge

Dynex Semiconductor

DIM200PHM33-F000 Features

* I I I I KEY PARAMETERS VCES VCE(sat)

* IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability

* Measured at auxiliary terminals. APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1

DIM200PHM33-F000 Datasheet (208.38 KB)

DIM200PHM33-F000 Datasheet Preview — Preview of DIM200PHM33-F000 PDF

Datasheet Details

Part number:

DIM200PHM33-F000

Manufacturer:

Dynex Semiconductor

File Size:

208.38 KB

Description:

Igbt modules - half bridge.

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DIM200PHM33-F000 Igbt Modules Half Bridge Dynex Semiconductor

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