DIM200PHM33-F000 Igbt Modules - Half Bridge

Dynex Semiconductor

Description

www.DataSheet4U.com DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module Preliminary Information DS5606-1.2 June 2003 .

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Datasheet Specifications

Part number: DIM200PHM33-F000
Manufacturer: Dynex Semiconductor
File Size: 208.38 KB
Datasheet: DIM200PHM33-F000_DynexSemiconductor.pdf
Description: Igbt Modules - Half Bridge

Features

* I I I I KEY PARAMETERS VCES VCE(sat)
* IC IC(PK) (typ) (max) (max) 3300V 3.0V 200A 400A Soft Punch Through Silicon 10µs Short Circuit Withstand Isolated MMC Base with AlN Substrates High Thermal Cycling Capability

Applications

* I I I 1(E1/C2) 2(C1) 5(E1) 4(G1) 3(E2) 7(E2) 6(G2) High Reliability Inverters Motor Controllers Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up

DIM200PHM33-F000 Distributors

📁 Related Datasheet

DIM200PHM33-A000 DIM200MHS17-A000 DIM2400ESM17-A000 DIM2400ESM17-PT500 DIM250KHM33-TS001 DIM250PHM33-TL000

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DIM200PHM33-F000 Igbt Modules Half Bridge Dynex Semiconductor

Dynex Semiconductor DIM200PHM33-F000-like datasheet