M14D2561616A-2.5BIG2C, M14D2561616A-1.5BIG2C - DDR II SDRAM

ESMT

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M14D2561616A-2.5BIG2C Datasheet Preview — This datasheet PDF includes multiple part numbers: M14D2561616A-2.5BIG2C, M14D2561616A-1.5BIG2C. Please refer to the document for exact specifications by model.

Datasheet Details

Part number	M14D2561616A-2.5BIG2C, M14D2561616A-1.5BIG2C
Manufacturer	ESMT
File Size	1.57 MB
Description	DDR II SDRAM
Datasheet	M14D2561616A-1.5BIG2C-ESMT.pdf
Note	This datasheet PDF includes multiple part numbers: M14D2561616A-2.5BIG2C, M14D2561616A-1.5BIG2C. Please refer to the document for exact specifications by model.

M14D2561616A-2.5BIG2C Product details

Description

M14D2561616A (2C) Operation Temperature Condition -40°C~95°C Ball Name A0~A12, BA0,BA1 DQ0~DQ15 RAS CAS WE VSS VDD DQS, DQS (LDQS, LDQS UDQS, UDQS ) ODT NC Function Address inputs - Row address A0~A12 - Column address A0~A8 A10/AP : Auto Precharge BA0, BA1 : Bank selects (4 Banks) Data-in/Data-out Command input Command input Command input Ground Power Bi-directional differential Data Strobe.LDQS and LDQS are DQS for DQ0~DQ7; UDQS and UDQS are DQS for DQ8~DQ15. On-Die-Termination.ODT is only

Features

JEDEC Standard.
VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V.
Internal pipelined double-data-rate architecture; two data access per clock cycle.
Bi-directional differential data strobe (DQS, DQS ); DQS can be disabled for single-ended data strobe operation.
On-chip DLL.
Differential clock inputs (CLK and CLK ).
DLL aligns DQ and DQS transition with CLK transition.
1KB page size - Row address: A0 to A12 - Column address: A0 to A8.
Quad bank operation.

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Published: Aug 18, 2025 |