WEDPNF8M721V-1012BM Datasheet, package equivalent, ETC

WEDPNF8M721V-1012BM Features

• Package n n n Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical n

PDF File Details

Part number:

WEDPNF8M721V-1012BM

Manufacturer:

ETC

File Size:

1.25MB

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📄 Datasheet

Description:

8mx72 synchronous dram + 8mb flash mixed module multi-chip package. The 64MByte (512Mb) SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134, 217, 728 bits. Each chip

WEDPNF8M721V-1012BM Application

• Applications SDRAM Upgradeable to 16M x 72 density (contact factory for information) Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32) density

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