Description
Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N minimizes both PCB space and RDS(ON).
Features
- 22 A, 30 V. RDS(ON) = 2.9 mΩ @ VGS = 10 V RDS(ON) = 4.5 mΩ @ VGS = 4.5 V.
- Occupies only 27.5 mm2 of PCB area: 1/5 of the area of a TO-220 package.
- Ultra-thin package: less than 0.90 mm height when mounted to PCB.
- Outstanding thermal transfer characteristics.
- Ultra-low gate charge x RDS(ON) product
F5047
Pin 1
DDDDDD DSSSSD DSSSSD DSSSSD DSSSSD DGS S SD
Bottom
Pin 1
Top
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDSS VG.
FDZ5047N Datasheet
