Part number:
LPD200
Manufacturer:
Filtronic Compound Semiconductors
File Size:
30.41 KB
Description:
High performance phemt.
* 21 dBm Output Power at 1-dB Compression at 18 GHz
* 12 dB Power Gain at 18 GHz
* 1.0 dB Noise Figure at 18 GHz
* 55% Power-Added Efficiency LPD200 GATE BOND PAD (2X) DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9
LPD200
Filtronic Compound Semiconductors
30.41 KB
High performance phemt.
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