HSMY-H670 - Surface Mount Flip Chip LEDs
The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.
The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.
Consequently as a result of the robust construction, product reliability is greatly improved.
The HSMX-H670 and
HSMY-H670 Features
* Improved Reliability Through Elimination of Internal Wire Bond
* -40 to 85°C Operating Temperature Range
* Small Size
* Industry Standard Footprint
* Diffused Optics
* Compatible with IR Solder Process
* Four Colors Available
* Availa
