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HSMY-H670

Surface Mount Flip Chip LEDs

HSMY-H670 Features

* Improved Reliability Through Elimination of Internal Wire Bond

* -40 to 85°C Operating Temperature Range

* Small Size

* Industry Standard Footprint

* Diffused Optics

* Compatible with IR Solder Process

* Four Colors Available

* Availa

HSMY-H670 General Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. The HSMX-H670 and.

HSMY-H670 Datasheet (229.21 KB)

Preview of HSMY-H670 PDF

Datasheet Details

Part number:

HSMY-H670

Manufacturer:

HP

File Size:

229.21 KB

Description:

Surface mount flip chip leds.

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TAGS

HSMY-H670 Surface Mount Flip Chip LEDs HP

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