and is subject to change without notice.
SK hynix does not assume any responsibility for use of circuits described.
No patent licenses are implied.
Rev 0.1 / Mar.
2014 1 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) L
H9TQ17ABJTMCUR-KTM Features
* [ CI-MCP ]
* Operation Temperature - (-25)oC ~ 85oC
* Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ]
* eMMC5.0 compatible (Backward compatible to eMMC4.5)
* Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits -
H9TQ17ABJTMCUR-HynixSemiconductor.pdf
Datasheet Details
H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR
Hynix Semiconductor
3.45 MB
16gb enand (x8) / lpddr3 16gb(x32).
This datasheet PDF includes multiple part numbers: H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR.
Please refer to the document for exact specifications by model.
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