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H9TQ17ABJTMCUR-KUM - 16GB eNAND (x8) / LPDDR3 16Gb(x32)
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK h.H9TQ17ABJTMCUR - 16GB eNAND (x8) / LPDDR3 16Gb(x32)
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK h.K9GAG08U0E - 16Gb E-die NAND Flash
Rev. 0.9.1,Mar. 2010 K9GAG08U0E K9LBG08U0E K9HCG08U1E Final 16Gb E-die NAND Flash Multi-Level-Cell (2bit/cell) datasheet SAMSUNG ELECTRONICS RESERV.MT60B4G4 - 16Gb DDR5 SDRAM
16Gb DDR5 SDRAM Die Rev A Features 16Gb DDR5 SDRAM Addendum MT60B4G4, MT60B2G8, MT60B1G16 Die Revision A Features This document describes the produ.IS21ES16G - 16GB eMMC
IS21ES04G/08G/16G/32G IS22ES04G/08G/16G/32G 4GB/8GB/16GB/32GB eMMC With eMMC 5.0 Interface ADVANCED DATA SHEET IS21/22ES04G/08G/16G/32G 4GB/8GB/16GB/.K9GAG08U0F - 16Gb F-die NAND Flash
Rev.1.1, May. 2011 K9GAG08U0F 16Gb F-die NAND Flash Multi-Level-Cell (2bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS.MT60B1G16 - 16Gb DDR5 SDRAM
16Gb DDR5 SDRAM Die Rev A Features 16Gb DDR5 SDRAM Addendum MT60B4G4, MT60B2G8, MT60B1G16 Die Revision A Features This document describes the produ.IS21EF16G - 16GB eMMC
IS21/22EF08G/16G IS21EF08G IS22EF08G IS21EF16G IS22EF16G 8GB/16GB eMMC with MLC NAND/eMMC 5.1 Interface DATA SHEET Integrated Silicon Solution, Inc..IS22EF16G - 16GB eMMC
IS21/22EF08G/16G IS21EF08G IS22EF08G IS21EF16G IS22EF16G 8GB/16GB eMMC with MLC NAND/eMMC 5.1 Interface DATA SHEET Integrated Silicon Solution, Inc..K9LBG08U0E - 16Gb E-die NAND Flash
Rev. 0.9.1,Mar. 2010 K9GAG08U0E K9LBG08U0E K9HCG08U1E Final 16Gb E-die NAND Flash Multi-Level-Cell (2bit/cell) datasheet SAMSUNG ELECTRONICS RESERV.HY27UH08AG5B - 16Gbit (2Gx8bit) NAND Flash
1 HY27UH08AG5B Series 16Gbit (2Gx8bit) NAND Flash 16Gb NAND FLASH HY27UH08AG5B This document is a general product description and is subject to chan.H9TQ17ABJTMCUR-KTM - 16GB eNAND (x8) / LPDDR3 16Gb(x32)
CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK h.K4E6E304EB - 16Gb DDP LPDDR3 SDRAM
Rev. 0.0, May. 2015 K4E6E304EB Target 16Gb DDP LPDDR3 SDRAM 178FBGA, 11x11.5 256M x32 (32M x32 x 8banks) + 256M x32 (32M x32 x 8banks) This document a.DS90UB954-Q1 - Dual 4.16Gbps FPD-Link3 Deserializer Hub
DS90UB954-Q1 SNLS570C – AUGUST 2017 – REVISED JANUARY 2023 DS90UB954-Q1 Dual 4.16 Gbps FPD-Link III Deserializer Hub With MIPI CSI-2 Outputs for 2MP/6.MT60B2G8 - 16Gb DDR5 SDRAM
16Gb DDR5 SDRAM Die Rev A Features 16Gb DDR5 SDRAM Addendum MT60B4G4, MT60B2G8, MT60B1G16 Die Revision A Features This document describes the produ.IS62WV51216GBLL - ULTRA LOW POWER CMOS STATIC RAM
IS62WV51216GALL/BLL IS65WV51216GALL/BLL 512Kx16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM DECEMBER 2021 KEY FEATURES • High-speed access time: 45.IS22ES16G - 16GB eMMC
IS21ES04G/08G/16G/32G IS22ES04G/08G/16G/32G 4GB/8GB/16GB/32GB eMMC With eMMC 5.0 Interface ADVANCED DATA SHEET IS21/22ES04G/08G/16G/32G 4GB/8GB/16GB/.H5ANAG4NCJR - 16Gb DDR4 SDRAM
16Gb DDR4 SDRAM 16Gb DDR4 SDRAM Lead-Free&Halogen-Free (RoHS Compliant) H5ANAG4NCJR H5ANAG8NCJR H5ANAG6NCJR * SK hynix reserves the right to change p.EDFA164A1PF - 16Gb DDR3 Mobile RAM
COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP (14.0mm × 14.0mm, 220-ball FBGA) EDFA164A1PF Specifications • Density: 16Gb • Organization — 4 pieces o.MT36KSF2G72PZ - 16GB 1.35V DDR3L SDRAM RDIMM
16GB (x72, ECC, DR) 240-Pin 1.35V DDR3L RDIMM Features 1.35V DDR3L SDRAM RDIMM MT36KSF2G72PZ – 16GB Features • DDR3L functionality and operations sup.