* z Maximum Lead Temperature for Soldering 1.6mm (0.062 in.) from Case for 10s TO-263 TO-220 z z Optimized for Low Conduction and Switching Losses Square RBSOA International Standard Packages Advantages z z High Power Density Low Gate Drive Requirement Applications z Symbol Test Conditions (TJ
IXGP16N60B2 Datasheet (243.20 KB)
IXGP16N60B2
IXYS Corporation
243.20 KB
Hiperfast igbt.
HiPerFASTTM IGBTs B2-Class High Speed
IXGA16N60B2 IXGP16N60B2
VCES = IC110 = VCE(sat) ≤ tfi(typ) =
600V 16A 2.3V 70ns
TO-263 AA (IXGA)
Symbol VCE.
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